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                激光器芯片扩膜摘料设备
                激光器芯片扩膜摘料设备:激光器芯片经过划片、裂片后,进行蓝膜扩膜分隔产品间〓距,通过OCR字符识别与Map表格对应,实现力控吸取物料Wafer To Tray,并且检测N面,P面,共晶面,Wire Boned面缺陷,良率达到99.95%以上。节省人力6人,经济效益50W/年、
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